E-Bonding is a complex process as it involves intricate field mapping between two ITSM tools. Many customers end up building bespoke solutions which are difficult to support, scale and extend.
BMC now provides an Out of the Box solution for E-Bonding called “VIPCON E-Bonding Runbook for BMC Atrium Orchestrator”. Features include;
- UI driven approach for creating an E-Bond
- Support for bi-directional communication between interfaces
- Scalable and Robust
- Provides a transaction database to recap loss of communication
I am happy to announce that “VIPCON E-Bonding Runbook for BMC Atrium Orchestrator v2.0.00" is now GA as of 31st August, 2017.
Please email me at Kapil_Dingore@bmc.com if you have any queries.